StarTech.com C3000 Manuel d'utilisateur

HP BladeSystem c3000 Enclosure technology brief, 2nd edition Abstract...

configured, the Insight Display verifies that there are no installation or configuration errors. The Installation Wizard turns off the enclosure UID

Figure 6. HP BladeSystem c3000 Onboard Administrator link module Enclosure link cabling The Onboard Administrator link module contains two enclos

Enclosure-based DVD ROM The HP BladeSystem c3000 Enclosure has an optional CD/DVD ROM drive that installs in the front of the enclosure. The Insight

Figure 7. Optional c3000 KVM Module – KVM menu screen Interconnect options and infrastructure A key component of the c3000 enclosure is the I/O i

Figure 8. Diagram of the HP BladeSystem c3000 signal midplane By taking advantage of the similar four-wire differential transmit and receive mecha

Figure 9. Logically overlaying physical lanes (right) onto sets of four traces (left) Each device bay connector has a 100-pin signal connector wit

Each interconnect module also provides external connectors that vary based on the particular design. In the c3000 enclosure, pairs of single-wide int

a Smart Array controller to enable hardware-based RAID configurations. A mezzanine card is not required to connect a half-height server blade to a di

4x DDR single-port mezzanine card will work equally well in Mezzanine 1, Mezzanine 2, or Mezzanine 3 connectors. Both types of mezzanine cards use a

Figure 10. HP BladeSystem c3000 interconnect bay numbering For interconnect bay mapping purposes, it does not matter in which device bay a server

HP BladeSystem Power Sizer ... 31 Summary ...

interconnects. It connects embedded Ethernet NICs to the internal facing ports on the Ethernet interconnect. Depending on the configuration requireme

signal midplane are allocated to the adjacent device bay. A four-port PCIe x8 mezzanine card installed in connector 2 PCIe x8 can send x2 signals to

Figure 13. HP BladeSystem c3000 device bay crosslinks as indicated by the arrows Interconnect bay crosslinks Interconnect bay crosslinks are wired

HP Thermal Logic technologies include many elements and capabilities: • Active Cool fans • Parallel Redundant Scalable Enclosure Cooling (PARSEC) d

Figure 15. Ducted fan cross-section and ducted fan blade compared to traditional server fan HP PARSEC architecture The c3000 enclosure uses PARSEC

Figure 16. HP BladeSystem c3000 self-sealing enclosure Redundant and scalable BladeSystem c3000 enclosures ship with four installed fans that pro

Figure 17. The c3000 enclosure fan bay and device bay population guidelines Thermal Logic for the server blade Precise ducting on HP server blade

Figure 18. Processor heat sink using fully ducted design (left) and a traditional heat sink in a 1U rack-mount server (right) Instant Thermal Moni

Figure 19. HP BladeSystem c3000 Enclosure supports up to six power supplies High efficiency HP c3000 power supplies provide greater than 90 percen

Figure 20. Remote site solution includes a c3000 enclosure with UPS and local KVM in a small 14U rack NOTE The rack-mountable HP R5500 UPS (5000VA

Abstract The HP BladeSystem c3000 Enclosure is the next generation in an evolution of the entire rack-mounted infrastructure. The c3000 enclosure is

Figure 21. Redundant HP BladeSystem c3000 power supplies connected to an HP R5500 UPS Connecting to PDUs with AC redundancy to each rack In an N+N

NOTE In redundant environments using Dynamic Power Saver mode, a minimum of two power supplies are always active. The maximum load for any power supp

type, application utilization, and ambient temperature. The BladeSystem Power Sizer is available at the following URL: http://www.hp.com/go/bladesyst

Appendix. Fan, power supply, and device bay population guidelines Figure A-1. Fan population guidelines for HP BladeSystem c3000 Enclosure. For corr

Figure A-2. Power supply population guidelines for HP BladeSystem c3000 Enclosure Table A-1. Power supply placement for HP BladeSystem c3000 Encl

Figure A-3. Full-height server blade device bay numbering for HP BladeSystem c3000 Enclosure. Full--height servers should be populated from bottom t

CAUTION To prevent improper cooling or thermal damage, do not operate the server blade or the enclosure unless all device bays are populated with eit

37 CAUTION If a full-height server blade is installed in device bay 1/5 and half-height server blades are installed in device bays 2 or 6, removing t

For more information For additional information, refer to the resources listed below. Resource description Web address General HP BladeSystem infor

Figure 2. HP BladeSystem c3000 Enclosure – rear view The HP BladeSystem c3000 Enclosure has redundant signal paths between servers and interconne

Table 1. Components supported by HP BladeSystem c-Class enclosures Enclosure c3000 c7000 Model Rack (6U) or Tower Rack (10U) Blade orientation H

the component. If a component is removed from a bay, the Onboard Administrator deletes the information about that component. Identifying components T

Figure 3. Management communications between Onboard Administrator and other components in an HP BladeSystem c3000 Enclosure c3000 internal managem

service port that allows users to temporarily connect a laptop PC to any of the linked enclosure Onboard Administrators for local diagnostics and deb

user credentials. Two-factor authentication allows even tighter security for the user management session to the Onboard Administrator. Rather than r